About ISEC

International Science and Engineering Community (ISEC) with its strong Scientific Board and Brand Name organizes first-class international conferences all over the world, mainly in science and engineering fields. Our first conference will take place in Barcelona.

Conference Topics

Aerospace Engineering

Artificial Intelligence



Chemical Engineering

Civil Engineering

Computer Sciences

Deep Learning

Electrical/Electronics Engineering


Industrial Engineering

Machine Learning


Mechanical Engineering

Nuclear Engineering

Optimization in Engineering



Scientific Board

Prof. Ed Hayes, New York University

Prof. Gary J. Cheng, Purdue University

Prof. Levent Kurt, The City University of New York

Prof. Nemkumar Banthia, University of British Columbia

Prof. Tao Wu, University of Nottingham Ningbo China

Important Days

Deadline of Abstract Submission: April 10th, 2019

Deadline of Registration and Payment: April 12th, 2019

Deadline of Early Registration and Payment: February 28th, 2019

Deadline of Full Paper Submission: April 12th, 2019

Please note that our web page provides the only enrollment opportunity for our conferences. We do not employ agents or any kind of intermediaries. Additionally, we have no country representative. Also our company neither endorses nor takes responsibility for applicant’s visa procedure. Should an applicant need a visa in order to attend one of our conferences, he or she bears the responsibility of having his or her own visa by applying the consular sections of appropriate countries’ embassies.

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